1. Isingeniso
Ikhebula lokuxhumana ekudlulisweni kwezibonakaliso ze-high-frequency, abaqhubi bazokhiqiza umphumela wesikhumba, futhi ngokunyuka kwemvamisa yesignali edlulisiwe, umphumela wesikhumba uyanda nakakhulu. Okubizwa ngokuthi umphumela wesikhumba kubhekisela ekudluliseni amasignali endaweni engaphandle yomqhubi wangaphakathi kanye nendawo yangaphakathi yomqhubi wangaphandle wekhebula le-coaxial lapho imvamisa yesignali edlulisiwe ifinyelela ku-kilohertz eziningana noma amashumi ezinkulungwane ze-hertz.
Ikakhulukazi, ngenani lamazwe ngamazwe lokukhuphuka kwethusi kanye nezinsiza zethusi emvelweni liya liba lincane kakhulu, ngakho-ke ukusetshenziswa kwensimbi egqoke ithusi noma ucingo lwe-aluminium ehlanganiswe nethusi ukuze kuthathelwe indawo ama-conductor ethusi, sekube umsebenzi obalulekile wocingo futhi imboni yokukhiqiza amakhebula, kodwa futhi nokukhuthazwa kwayo ngokusetshenziswa kwendawo enkulu yemakethe.
Kodwa i-wire plating yethusi, ngenxa yokwelashwa kwangaphambili, i-nickel yangaphambi kokucwenga nezinye izinqubo, kanye nomthelela wesisombululo se-plating, kulula ukukhiqiza izinkinga ezilandelayo kanye nokukhubazeka: i-wire blackening, i-pre-plating ayilungile. , i-plating layer eyinhloko esikhumbeni, okuholela ekukhiqizeni ucingo lwemfucuza, imfucuza yezinto ezibonakalayo, ukuze izindleko zokukhiqiza umkhiqizo zikhuphuke. Ngakho-ke, kubaluleke kakhulu ukuqinisekisa ikhwalithi yokugqoka. Leli phepha lixoxa ngokuyinhloko ngezimiso zenqubo kanye nezinqubo zokukhiqizwa kocingo lwensimbi yethusi nge-electroplating, kanye nezimbangela ezivamile zezinkinga zekhwalithi nezindlela zokuxazulula. 1 Inqubo yokufaka i-Copper-clad steel wire plating kanye nezimbangela zayo
1. 1 Ukwelashwa kwangaphambili kocingo
Okokuqala, ucingo lucwiliswa kusisombululo se-alkaline kanye ne-pickling, futhi i-voltage ethile isetshenziswa ocingweni (i-anode) kanye nepuleti (i-cathode), i-anode ibeka inani elikhulu le-oxygen. Indima eyinhloko yala magesi yilezi: eyodwa, amabhamuza anobudlova ebusweni bocingo lwensimbi kanye ne-electrolyte yayo eseduze idlala ukuphazamiseka komshini kanye nomphumela wokuhlubula, ngaleyo ndlela ithuthukise uwoyela ebusweni bocingo lwensimbi, isheshise inqubo ye-saponification kanye ne-emulsification amafutha namafutha; okwesibili, ngenxa yamabhamuza amancane anamathiselwe esibonakalayo phakathi kwensimbi nesixazululo, namagwebu kanye nocingo lwensimbi ngaphandle, amabhamuza azobe enamathela ocingweni lwensimbi olunamafutha amaningi ebusweni besixazululo, ngakho-ke, Ama-bubbles azoletha amafutha amaningi anamathela ocingweni lwensimbi ebusweni besixazululo, ngaleyo ndlela akhuthaze ukususwa kwamafutha, futhi ngesikhathi esifanayo, akulula ukukhiqiza i-hydrogen embrittlement ye-anode, ukuze kube kuhle. Plating ingatholakala.
1. 2 Ukucwecwa kocingo
Okokuqala, ucingo luphathwa ngaphambili futhi lufakwe ngaphambili nge-nickel ngokucwiliswa esixazululweni se-plating futhi lusebenzise i-voltage ethile ocingweni (i-cathode) kanye nepuleti yethusi (i-anode). Ku-anode, ipuleti lethusi lilahlekelwa ama-electron futhi lenze ama-ion ethusi e-divalent mahhala kubhavu ye-electrolytic (plating):
Cu – 2e→Cu2+
Ku-cathode, intambo yensimbi yenziwa kabusha ngogesi futhi ama-ion ethusi ahlukanisiwe afakwa ocingweni ukuze kwakheke intambo yensimbi eboshwe ngethusi:
Cu2 + + 2e→ Cu
Cu2 + + e→ Cu +
Cu + + e→ Cu
2H + + 2e→ H2
Uma inani le-asidi esixazululweni sokucwenga linganele, i-cuprous sulphate igaywa kalula ukuze yakhe i-cuprous oxide. I-cuprous oxide ivaleleke kungqimba lwe-plating, iyenze ikhululeke. Cu2 SO4 + H2O [Cu2O + H2 SO4
I. Izingxenye Ezibalulekile
Izintambo ezibonakalayo zangaphandle ngokuvamile zinemicu engenalutho, ishubhu elixegayo, izinto ezivimba amanzi, izakhi eziqinisayo, nomgodla wangaphandle. Ziza ngezakhiwo ezihlukahlukene ezifana ne-central tube design, i-layer stranding, kanye nesakhiwo samathambo.
Imicu engenalutho ibhekisela emiculweni yasekuqaleni enobubanzi obungama-micrometer angu-250. Ngokuvamile zihlanganisa isendlalelo esiyinhloko, isendlalelo sokuvala, kanye nosendlalelo sokumboza. Izinhlobo ezihlukene zemicu engenalutho inosayizi abahlukene bongqimba obuyinhloko. Isibonelo, imicu ye-OS2 yemodi eyodwa ngokuvamile ingama-micrometer angu-9, kuyilapho imicu ye-multimode i-OM2/OM3/OM4/OM5 ingama-micrometer angu-50, kanti imicu ye-multimode OM1 ingama-micrometer angu-62.5. Imicu engenalutho ivamise ukufakwa amakhodi ngombala ukuze kuhlukaniseke phakathi kwama-multi-core fibers.
Amashubhu axegayo ngokuvamile enziwa ngobunjiniyela bepulasitiki obuqinile obuphezulu be-PBT futhi asetshenziselwa ukufaka imicu engenalutho. Zinikeza isivikelo futhi zigcwaliswa ngejeli yokuvimbela amanzi ukuvimbela ukungena kwamanzi okungalimaza imicu. Ijeli futhi isebenza njengesivimbeli ukuvikela ukulimala kwefayibha emithelela. Inqubo yokukhiqiza amashubhu axegayo ibalulekile ukuze kuqinisekiswe ubude obudlulele be-fiber.
Izinto ezivimbela amanzi zihlanganisa amafutha avimbela amanzi ekhebula, intambo yokuvimba amanzi, noma impushana evimba amanzi. Ukuze kuthuthukiswe ikhono lilonke lekhebula lokuvimbela amanzi, indlela evamile iwukusebenzisa amafutha avimba amanzi.
Izinto eziqinisayo ziza ngezinhlobo zensimbi nezingezona ezensimbi. Ezensimbi ngokuvamile zenziwe ngezintambo zensimbi ze-phosphated, amateyipu e-aluminium, noma amateyipu ensimbi. Izinto ezingezona ezensimbi ngokuyinhloko zenziwe ngezinto ze-FRP. Kungakhathalekile ukuthi iyiphi into esetshenzisiwe, lezi zakhi kumele zinikeze amandla adingekayo ukuze kuhlangatshezwane nezidingo ezijwayelekile, okuhlanganisa ukumelana nokushuba, ukugoba, umthelela, nokusonteka.
Amashethi angaphandle kufanele acabangele indawo esetshenziswayo, okuhlanganisa ukuvikela amanzi, ukumelana ne-UV, nokumelana nesimo sezulu. Ngakho-ke, izinto ezimnyama ze-PE zivame ukusetshenziswa, njengoba izakhiwo zayo ezinhle kakhulu zomzimba namakhemikhali ziqinisekisa ukufaneleka kokufakwa kwangaphandle.
2 Izimbangela zezinkinga zekhwalithi ohlelweni lwe-copper plating kanye nezixazululo zazo
2. 1 Umthelela wokwelashwa kwangaphambili kocingo kungqimba lokucwenga Ukwelashwa kwangaphambili kocingo kubaluleke kakhulu ekukhiqizweni kocingo lwensimbi oluboshwe ngethusi nge-electroplating. Uma ifilimu yamafutha ne-oxide ebusweni bocingo ingaqediwe ngokuphelele, khona-ke ungqimba lwe-nickel olufakwe ngaphambili alufakwanga kahle futhi ukubopha kumpofu, okuzogcina kuholele ekutheni ungqimba oluyinhloko lwe-copper plating luwa. Ngakho-ke kubalulekile ukugcina iso ekugxilweni koketshezi lwe-alkaline kanye ne-pickling, i-pickling kanye ne-alkaline yamanje nokuthi amaphampu ajwayelekile yini, futhi uma engenjalo, kufanele alungiswe ngokushesha. Izinkinga zekhwalithi ezivamile ekwelapheni kwangaphambili kocingo lwensimbi kanye nezixazululo zazo kuboniswa kuThebula
2. 2 Ukuzinza kwesixazululo se-pre-nickel kunquma ngokuqondile ikhwalithi yesendlalelo sangaphambi kokucwenga futhi kudlala indima ebalulekile esinyathelweni esilandelayo se-copper plating. Ngakho-ke, kubalulekile ukuhlaziya njalo futhi ulungise isilinganiso sokwakheka kwesixazululo se-nickel esifakwe ngaphambili kanye nokuqinisekisa ukuthi isisombululo se-nickel esifakwe ngaphambili sihlanzekile futhi asingcolisiwe.
I-2.3 Ithonya lesisombululo esiyinhloko se-plating kungqimba lokucwenga Isixazululo se-plating siqukethe i-sulphate yethusi ne-sulfuric acid njengezingxenye ezimbili, ukubunjwa kwesilinganiso kunquma ngokuqondile ikhwalithi ye-plating layer. Uma ukuhlushwa kwe-sulphate yethusi kuphezulu kakhulu, amakristalu e-copper sulphate azokwenyuka; uma ukugxila kwe-copper sulphate kuphansi kakhulu, ucingo luzoshiswa kalula futhi ukusebenza kahle kwe-plating kuzothinteka. I-Sulfuric acid ingathuthukisa ukuqhutshwa kukagesi kanye nokusebenza kahle kwamanje kwesisombululo se-electroplating, yehlise ukugcwala kwama-ion ethusi kusixazululo se-electroplating (umphumela we-ion ofanayo), ngaleyo ndlela ithuthukise i-cathodic polarization kanye nokuhlakazeka kwesixazululo se-electroplating, ukuze ukuminyana kwamanje. umkhawulo uyakhuphuka, futhi uvimbele i-hydrolysis ye-cuprous sulphate kusixazululo se-electroplating ibe yi-cuprous oxide nemvula, okwandisa ukuzinza kwesisombululo sokucwenga, kodwa futhi kunciphisa i-anodic polarisation, evumela ukuchithwa okuvamile kwe-anode. Kodwa-ke, kufanele kuqashelwe ukuthi okuqukethwe okuphezulu kwe-sulfuric acid kuzonciphisa ukuncibilika kwe-sulphate yethusi. Lapho okuqukethwe kwe-sulfuric acid kusisombululo sokucwenga kunganele, i-copper sulphate ifakwa kalula nge-hydrolyzed ibe yi-cuprous oxide futhi iboshwe kungqimba lokucwenga, umbala wesendlalelo uba mnyama futhi uxege; lapho kune-asidi ye-sulfuric eyeqile esixazululweni sokucwenga futhi usawoti wethusi ungenele, i-hydrogen izokhishwa kancane ku-cathode, ukuze ingaphezulu le-plating layer libonakale linamabala. I-Phosphorus ipuleti lethusi le-phosphorus okuqukethwe nakho kunomthelela obalulekile kwikhwalithi ye-coating, okuqukethwe kwe-phosphorus kufanele kulawulwe ku-0. 04% kuya ku-0. 07%, uma ngaphansi kuka-0. 02%, kunzima ukwakha ifilimu yokuvimbela ukukhiqizwa kwe-ion yethusi, ngaleyo ndlela ikhulise i-powder yethusi kwisisombululo se-plating; uma okuqukethwe kwe-phosphorus okungaphezu kuka-0. 1%, kuzothinta ukuqedwa kwe-anode yethusi, ukuze okuqukethwe kwe-ion yethusi ye-bivalent kusixazululo se-plating kuncipha, futhi kukhiqize udaka oluningi lwe-anode. Ngaphezu kwalokho, ipuleti lethusi kufanele lihlanjululwe njalo ukuze kuvinjelwe udaka lwe-anode ekungcoliseni isixazululo sokucwenga futhi kubangele ukuhwalala nama-burrs kungqimba lokucwenga.
3 Isiphetho
Ngokucutshungulwa kwezici ezishiwo ngenhla, ukunamathela nokuqhubeka komkhiqizo kuhle, ikhwalithi izinzile futhi nokusebenza kuhle kakhulu. Kodwa-ke, enqubweni yokukhiqiza yangempela, kunezici eziningi ezithinta ikhwalithi ye-plating layer ohlelweni lokucwenga, uma inkinga isitholakele, kufanele ihlaziywe futhi ifundwe ngesikhathi futhi kufanele kuthathwe izinyathelo ezifanele ukuyixazulula.
Isikhathi sokuthumela: Jun-14-2022