1. Isingeniso
Ikhebula lokuxhumana ekudlulisweni kwezibonakaliso zemvamisa ephezulu, abaqhubi bazokhiqiza umphumela wesikhumba, futhi ngokwanda kwemvamisa yesignali edlulisiwe, umphumela wesikhumba uba yingozi kakhulu. Lokho okubizwa ngokuthi umphumela wesikhumba kubhekisela ekudlulisweni kwezibonakaliso ebusweni bangaphandle bomqhubi wangaphakathi kanye nobuso bangaphakathi bomqhubi wangaphandle wekhebula le-coaxial lapho imvamisa yesignali edlulisiwe ifinyelela ama-kilohertz amaningana noma amashumi ezinkulungwane ze-hertz.
Ikakhulukazi, njengoba intengo yethusi emhlabeni wonke ikhuphuka kanye nezinsiza zethusi ngokwemvelo ziya ngokuya zincipha, ngakho-ke ukusetshenziswa kwensimbi embozwe ngethusi noma ucingo lwe-aluminium olumbozwe ngethusi ukuze kuthathelwe indawo abaqhubi bethusi, sekube umsebenzi obalulekile embonini yokukhiqiza ucingo kanye nekhebula, kodwa futhi nasekuthuthukisweni kwayo ngokusebenzisa indawo enkulu yemakethe.
Kodwa ucingo olusesitsheni sethusi, ngenxa yokwelashwa kwangaphambi kwesikhathi, i-nickel yangaphambi kwesikhathi kanye nezinye izinqubo, kanye nomthelela wesisombululo se-plating, kulula ukukhiqiza izinkinga ezilandelayo kanye namaphutha: ukumnyama kwentambo, i-pre-plating ayilungile, ungqimba oluyinhloko lwe-plating luphuma esikhumbeni, okuholela ekukhiqizweni kwentambo engcolile, imfucuza yezinto ezibonakalayo, ukuze izindleko zokukhiqiza umkhiqizo zikhuphuke. Ngakho-ke, kubaluleke kakhulu ukuqinisekisa ikhwalithi yengubo. Leli phepha lixoxa kakhulu ngezimiso zenqubo kanye nezinqubo zokukhiqizwa kwentambo yensimbi embozwe ngethusi nge-electroplating, kanye nezimbangela ezivamile zezinkinga zekhwalithi kanye nezindlela zesisombululo. 1 Inqubo ye-copper-clad wire wire plating kanye nezimbangela zayo
1. 1 Ukwelashwa kwangaphambi kocingo
Okokuqala, ucingo lucwiliswa kusisombululo se-alkaline kanye ne-pickling, bese kufakwa i-voltage ethile ku-wire (anode) kanye ne-plate (cathode), i-anode ikhipha umoya-mpilo omningi. Indima eyinhloko yalezi gesi yile: okokuqala, amabhamuza anolaka ebusweni bentambo yensimbi kanye ne-electrolyte yayo eseduze idlala umphumela wokushukuma nokususa, ngaleyo ndlela ikhuthaza uwoyela ebusweni bentambo yensimbi, isheshise inqubo ye-saponification kanye ne-emulsification yamafutha kanye namafutha; okwesibili, ngenxa yamabhamuza amancane anamathele esixhumini esiphakathi kwensimbi nesixazululo, lapho amabhamuza kanye nentambo yensimbi iphuma, amabhamuza azonamathela ku-wire yensimbi enamafutha amaningi ebusweni besixazululo, ngakho-ke, ku-Amabhamuza azoletha uwoyela omningi onamathele ku-wire yensimbi ebusweni besixazululo, ngaleyo ndlela akhuthaze ukususwa kwamafutha, futhi ngesikhathi esifanayo, akulula ukukhiqiza i-hydrogen embrittlement ye-anode, ukuze kutholakale i-plating enhle.
1. 2 Ukufakwa kwentambo
Okokuqala, ucingo luphathwa kusengaphambili futhi lufakwe i-nickel kusengaphambili ngokulifaka esixazululweni se-plating bese kufakwa i-voltage ethile ku-wire (cathode) kanye ne-copper plate (anode). Ku-anode, i-copper plate ilahlekelwa ama-electron futhi yakhe ama-free divalent copper ion ebhavini le-electrolytic (plating):
I-Cu – 2e→I-Cu2+
Ku-cathode, ucingo lwensimbi luphinde lusetshenziswe ngogesi futhi ama-ion ethusi ahlukene afakwa ocingweni ukuze akhe ucingo lwensimbi olumbozwe ngethusi:
I-Cu2 + + 2e→ I-Cu
Cu2 + + e→ Cu +
Cu + + e→ Cu
2H + + 2e→ H2
Uma inani le-asidi esixazululweni se-plating linganele, i-cuprous sulphate ifakwa kalula emanzini ukuze yakhe i-cuprous oxide. I-cuprous oxide ibanjwe ungqimba lwe-plating, okwenza ikhululeke. I-Cu2 SO4 + H2O [Cu2O + H2 SO4
I. Izingxenye Eziyinhloko
Izintambo ze-optical zangaphandle ngokuvamile zakhiwa imicu engenalutho, ishubhu elixegayo, izinto zokuvimba amanzi, izinto zokuqinisa, kanye ne-sheath yangaphandle. Ziza ngezakhiwo ezahlukahlukene njengokuklama ishubhu eliphakathi, ukugoba kwezingqimba, kanye nesakhiwo samathambo.
Imicu engenalutho ibhekisela kuma-fiber optical okuqala anobubanzi obungama-micrometer angu-250. Ngokuvamile afaka ungqimba oluyinhloko, ungqimba lwe-cladding, kanye nongqimba lokumboza. Izinhlobo ezahlukene zemicu engenalutho zinobukhulu obuhlukene bengqimba oluyinhloko. Isibonelo, imicu ye-OS2 yemodi eyodwa ngokuvamile ingama-micrometer angu-9, kuyilapho imicu ye-OM2/OM3/OM4/OM5 yemodi eningi ingama-micrometer angu-50, kanti imicu ye-OM1 yemodi eningi ingama-micrometer angu-62.5. Imicu engenalutho ivame ukufakwa imibala ukuze ihlukanise phakathi kwemicu ye-multi-core.
Amashubhu akhululekile avame ukwenziwa ngepulasitiki yobunjiniyela enamandla aphezulu i-PBT futhi asetshenziselwa ukufaka imicu engenalutho. Ahlinzeka ngokuvikelwa futhi agcwele ijeli evimba amanzi ukuvimbela ukungena kwamanzi okungalimaza imicu. Ijeli futhi isebenza njengesivikelo sokuvimbela umonakalo wefayibha ekushayweni. Inqubo yokukhiqiza amashubhu akhululekile ibalulekile ukuqinisekisa ubude obedlulele befayibha.
Izinto zokuvimba amanzi zifaka igrisi yokuvimba amanzi ngekhebula, intambo yokuvimba amanzi, noma impuphu yokuvimba amanzi. Ukuze kuthuthukiswe ikhono lekhebula lokuvimba amanzi, indlela eyinhloko ukusebenzisa igrisi yokuvimba amanzi.
Izinto eziqinisayo ziza ngezinhlobo zensimbi nezingezona ezensimbi. Ezensimbi zivame ukwenziwa ngezintambo zensimbi ezine-phosphate, amatheyipu e-aluminium, noma amatheyipu ensimbi. Izinto ezingezona ezensimbi zenziwe ngokuyinhloko ngezinto ze-FRP. Kungakhathaliseki ukuthi zisetshenziswa ngayiphi impahla, lezi zinto kumele zinikeze amandla adingekayo omshini ukuze zihlangabezane nezidingo ezijwayelekile, okuhlanganisa ukumelana nokucindezeleka, ukugoba, ukushayisana, kanye nokusonta.
Ama-sheath angaphandle kufanele acabangele indawo yokusetshenziswa, okuhlanganisa ukuvimbela amanzi, ukumelana ne-UV, kanye nokumelana nesimo sezulu. Ngakho-ke, izinto ezimnyama ze-PE zivame ukusetshenziswa, njengoba izakhiwo zazo ezinhle kakhulu zomzimba nezamakhemikhali ziqinisekisa ukufaneleka kokufakwa ngaphandle.
2 Izimbangela zezinkinga zekhwalithi enqubweni yokubopha ithusi kanye nezixazululo zazo
2. 1 Ithonya lokwelashwa kwangaphambi kocingo ongqimbeni lokufaka insimbi Ukwelashwa kwangaphambi kocingo kubaluleke kakhulu ekukhiqizweni kwentambo yensimbi embozwe ngethusi ngokufakwa nge-electroplating. Uma ifilimu kawoyela ne-oxide ebusweni bentambo ingasuswa ngokuphelele, khona-ke ungqimba lwe-nickel olumbozwe ngaphambili alumboziwe kahle futhi ukubopha kukubi, okuzogcina kuholele ekutheni ungqimba oluyinhloko lokufaka insimbi yethusi luwe. Ngakho-ke kubalulekile ukubheka ukugcwala koketshezi lwe-alkaline nolwe-pickling, i-pickling kanye ne-alkaline current nokuthi amaphampu ajwayelekile yini, futhi uma engekho, kumele alungiswe ngokushesha. Izinkinga ezijwayelekile zekhwalithi ekuphathweni kwangaphambi kocingo lwensimbi kanye nezixazululo zazo ziboniswe kuThebula
2. 2 Ukuqina kwesixazululo sangaphambi kwe-nickel kunquma ngqo ikhwalithi yesendlalelo sangaphambi kwe-plating futhi kudlala indima ebalulekile esinyathelweni esilandelayo se-copper plating. Ngakho-ke, kubalulekile ukuhlaziya njalo nokulungisa isilinganiso sokwakheka kwesisombululo se-nickel esandulelwe i-plating nokuqinisekisa ukuthi isisombululo se-nickel esandulelwe i-plating sihlanzekile futhi asingcolisiwe.
2.3 Ithonya lesixazululo esiyinhloko sokufaka ungqimba lwe-plating Isixazululo sokufaka ungqimba siqukethe i-sulphate yethusi kanye ne-sulfuric acid njengezingxenye ezimbili, ukwakheka kwesilinganiso kunquma ngqo ikhwalithi yesigaba sokufaka ungqimba. Uma ukuhlushwa kwe-sulphate yethusi kuphezulu kakhulu, amakristalu e-sulphate ethusi azokhuphuka; uma ukuhlushwa kwe-sulphate yethusi kuphansi kakhulu, ucingo luzoshiswa kalula futhi ukusebenza kahle kokufaka kuzothinteka. I-Sulphuric acid ingathuthukisa ukuqhuba kukagesi kanye nokusebenza kahle kwamanje kwesisombululo se-electroplating, inciphise ukuhlushwa kwama-ion ethusi esixazululweni se-electroplating (umphumela ofanayo we-ion), ngaleyo ndlela ithuthukise i-cathodic polarisation kanye nokusabalala kwesisombululo se-electroplating, ukuze umkhawulo wobuningi bamanje ukhuphuke, futhi kuvimbele i-hydrolysis ye-cuprous sulphate esixazululweni se-electroplating ibe yi-cuprous oxide kanye nemvula, kwandisa ukuzinza kwesisombululo sokufaka ungqimba, kodwa futhi kunciphise i-anodic polarisation, okusiza ekuncibilikeni okuvamile kwe-anode. Kodwa-ke, kufanele kuqashelwe ukuthi okuqukethwe okuphezulu kwe-asidi ye-sulfuric kuzonciphisa ukuncibilika kwe-sulphate yethusi. Uma okuqukethwe kwe-asidi ye-sulfuric esixazululweni se-plating kunganele, i-sulphate yethusi ifakwa kalula ku-hydrolyzed ibe yi-cuprous oxide bese ibanjwa engqimbeni ye-plating, umbala wengqimba uba mnyama futhi ukhululeke; uma kukhona i-asidi ye-sulfuric eyengeziwe esixazululweni se-plating futhi okuqukethwe kukasawoti wethusi kunganele, i-hydrogen izokhishwa kancane ku-cathode, ukuze ubuso bengqimba ye-plating bubonakale bunamabala. Ukuqukethwe kwe-phosphorus yepuleti yethusi ye-phosphorus nakho kunomthelela obalulekile ekhwalithini yengubo, okuqukethwe kwe-phosphorus kufanele kulawulwe kusukela ku-0.04% kuya ku-0.07%, uma kungaphansi kuka-0.02%, kunzima ukwakha ifilimu ukuvimbela ukukhiqizwa kwama-ion ethusi, ngaleyo ndlela kwandiswe ufulawa wethusi esixazululweni se-plating; Uma okuqukethwe yi-phosphorus kungaphezu kuka-0.1%, kuzothinta ukuncibilika kwe-anode yethusi, ukuze okuqukethwe kwama-ion ethusi ahlanganayo kusisombululo se-plating kunciphe, futhi kukhiqize udaka oluningi lwe-anode. Ngaphezu kwalokho, ipuleti yethusi kufanele lihlanzwe njalo ukuvimbela udaka lwe-anode ekungcoliseni isisombululo se-plating futhi kubangele ukurhabaxa kanye nama-burrs kungqimba lwe-plating.
3 Isiphetho
Ngokucutshungulwa kwezici ezishiwo ngenhla, ukunamathela nokuqhubeka komkhiqizo kuhle, ikhwalithi izinzile futhi ukusebenza kuhle kakhulu. Kodwa-ke, enkambisweni yokukhiqiza yangempela, kunezici eziningi ezithinta ikhwalithi yesendlalelo seplating enkambisweni yeplating, uma inkinga isitholakele, kufanele ihlaziywe futhi ifundwe ngesikhathi futhi kufanele kuthathwe izinyathelo ezifanele zokuyixazulula.
Isikhathi sokuthunyelwe: Juni-14-2022